It’s getting organized on the carmaker side. Today, it is the turn of the giant Stellantis to announce a new partnership with Foxconn to design and sell new flexible semiconductors for the automotive industry.
Indeed, the two entities have signed a non-binding memorandum of understanding to create a partnership in this sense. This family of semiconductors would be specifically designed to support Stellantis, but also third-party customers.
Unveiled at the Stellantis Software Day 2021 event, the partnership also coincided with the new STLA Brain electric/electronic/software platform, the latter of which will be launched in 2024 for the group’s four electric automotive platforms – STLA Small, STLA, Medium, STLA Large and STLA Frame.
“Our software transformation will be accompanied by excellent partners from all sectors and expertise,” said Carlos Tavares, CEO of Stellantis. “With Foxconn, we aim to create four chip families that will cover more than 80% of our semiconductor needs, upgrading our components, helping to reduce complexity and simplify the supply chain. It will also strengthen our ability to innovate faster and deliver products and services at a sustained pace.”
“As a leading global technology company, Foxconn has extensive experience in manufacturing semiconductors and software – two key components in electric vehicle production. We look forward to sharing this expertise with Stellantis and addressing supply chain shortages together as we continue to expand in the electric vehicle market,” said Young Liu, president and CEO of Foxconn Technology Group.
While it is clear that the current crisis is at the heart of this new union, it is also important to note that Foxconn has expertise, development capabilities and a supply chain in the semiconductor industry.
It should be remembered that the two players had already announced a first collaboration last May, with the creation of a Mobile Drive joint venture aimed at developing smart car solutions.